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HDJD-S722-QR999
Color Sensor
Data Sheet
Description
AvagoTechnologies'colorsensorisahighperformance, small in size, cost effective light to voltage converting sensor. The sensor combines a photodiode array and threetrans-impedanceamplifiersinasinglemonolithic CMOS IC solution. With a Red (R), Green (G) and Blue (B) color filters coated over the photodiode array, the sensorconvertsR,G,Blighttoanalogvoltageoutputs, denoted by VROUT, VGOUT and VBOUT, respectively. Thesensorispackagedina5x5x1(mm)surfacemount QFN-16package.
Features
* ConvertlighttoR,G,Bvoltageoutput * Monolithic CMOS IC solution with integrated R, G, B color filter, photodiode array, trans-impedance amplifierinonechip * 3 sets of 3x3 photodiode array design minimize the effect of contamination and optical aperture misalignment * Smallinsize5x5x1mm * Independent gain selection options for each R, G, B channel
Applications
AvagoTechnologies'colorsensorisidealforopen-loop coloridentificationandclosed-loopcolorpointcontrol. The sensor is designed for low illuminance applicationsincludingcolordetection,environmentallighting, industrial process, etc. With R, G, B photo-sensor and amplifier integrated in a single 5x5x1(mm) package, Avago Technologies' color sensor provides a high performance, small in size and cost effective solution tocolorsensing.
ESD WARNING: Standard CMOS handling precautions should be observed to avoid static discharge.
AVAGO TECHNOLOGIES' PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO TECHNOLOGIES OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
Package Dimension
5 6 7 8
Part Numbering System
HDJD-S7XX-XXXXX
9 10 11 12
4 3 2 1

Gain Selection (GS) Option 999:GS00,01or10 Packaging Type R:TapeandReel Product Packaging Q:QFN Product ID :ComponentwithoutIRFilter
16
15
14
13
BOTTOM VIEW 16L QFN 5X5 (0.8) (0.3)
5.0 0.15
(3.2)
(3.2) 5.0 0.15
1.0 0.15
NOTE: DIMENSIONS ARE IN MILLIMETERS (mm)
Pin Out for HDJD-S722-QR999 Pin Pin Name Normal Operation Pin 1 VBOUT Analog output voltage for BLUE Pin 2 VGOUT Analog output voltage for GREEN Pin 3 VROUT Analog output voltage for RED Pin 4 VDD 5 V DC Supply Pin 5 GND Ground Pin 6 GSGRN1 Gain Selection Green bit 1 Pin 7 GND Ground Pin 8 GSRED1 Gain Selection Red bit 1 Pin 9 GSRED0 Gain Selection Red bit 0 Pin 10 NC No connection Pin 11 NC No connection Pin 12 GSBLUE0 Gain Selection Blue bit 0 Pin 13 GSBLUE1 Gain Selection Blue bit 1 Pin 14 GND Ground Pin 15 GSGRN0 Gain Selection Green bit 0 Pin 16 GND Ground
Theory of Operation
TheintegralR,G,Bcolorfiltersonthephotodiodearray detecttheR,G,Bcomponentsofthelightfallingonthe sensor.The photodiode converts the R, G, B light components into photocurrents. The integrated transimpedenceamplifiersforR,G,Bcomponentsthenconvert thephotocurrenttoanalogvoltageoutputs.Thevoltage outputofeachR,G,Bchannelincreaseslinearlywithincreasinglightintensity.
Sensor IC Block Diagram
RF CF GS (1:0)
VDD5 - + GND
TRANSIMPEDANCE AMP RF CF GS (1:0)
VROUT
GSRED (1:0)
RED GAIN SELECTION
- +
TRANSIMPEDANCE AMP RF CF GS (1:0)
VGOUT
GSGRN (1:0)
GREEN GAIN SELECTION
GSBLUE (1:0)
BLUE GAIN SELECTION
- +
TRANSIMPEDANCE AMP
VBOUT
Absolute Maximum Ratings[1,2] Parameter SupplyVoltage StorageTemperature OperatingTemperature HumanBodyModelESDRating
Symbol VDD TS TA ESDHBM
Min. 4.5 -40 -40
Max. 5.5 100 85 1
Unit V C C kV
Notes
Notes: 1. Subjectingtheparttostressesbeyondthoselistedunderthissectionmaycausepermanentdamagetothedevice.Thesearestressratings onlyanddonotimplythatthedeviceswillfunctionbeyondtheseratings.Exposuretotheextremesoftheseconditionsforextendedperiods mayaffectdevicereliability. . Unlessotherwisespecified,voltagesarereferencedtoground.
Recommended Operating Conditions Parameter Symbol OperatingTemperature TA SupplyVoltage VDD
Min. 0 4.5
Typ. 5 5.0
Max. 70 5.5
Units C V
Notes Adecouplingcapacitorof100nF betweenVDDandgroundisrecommended.
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Operating Conditions and Electrical Requirements Electrical Characteristics at VDD = 5 V, TA = 25C, RL = 68 k Parameter Symbol Remark Min. Dark Voltage VD Ee = 0 Max. Output Voltage Swing VOMAX Supply Current IDD Ee = 0 Irradiance Responsivity GS:10, lP = 460 nm[1] (Blue Channel) Re GS:10, lP = 542 nm[2] (Green Channel) GS:10, lP = 645 nm[3] (Red Channel) Irradiance Responsivity GS:01, lP = 460 nm[1] (Blue Channel) Re GS:01, lP = 542 nm[2] (Green Channel) GS:01, lP = 645 nm[3] (Red Channel) Irradiance Responsivity GS:00, lP = 460 nm[1] (Blue Channel) Re GS:00, lP = 542 nm[2] (Green Channel) GS:00, lP = 645 nm[3] (Red Channel) Saturation Irradiance[4] GS:10, lP = 460 nm[1] (Blue Channel) GS:10, lP = 542 nm[2] (Green Channel) GS:10, lP = 645 nm[3] (Red Channel) [4] Saturation Irradiance GS:01, lP = 460 nm[1] (Blue Channel) GS:01, lP = 542 nm[2] (Green Channel) GS:01, lP = 645 nm[3] (Red Channel) Saturation Irradiance[4] GS:00, lP = 460 nm[1] (Blue Channel) GS:00, lP = 542 nm[2] (Green Channel) GS:00, lP = 645 nm[3] (Red Channel) Output Rise Time tr GS:00 to GS01; Test Condition[5] (min Vo = 0V, peak Vo = 2V) GS:10; Test Condition[5] (min Vo = 0V, peak Vo = 2V) Output Fall Time tf GS:00 to GS01; Test Condition[5] (min Vo = 0V, peak Vo = 2V) GS:10; Test Condition[5] (min Vo = 0V, peak Vo = 2V)
Typ. 15 4.8 2.5 15 19 27 9 11 16 5 6 9 0.32 0.25 0.18 0.53 0.44 0.30 0.96 0.80 0.53 45 220 50 240
Max.
Unit mV V mA V/(mW/cm2)
V/(mW/cm2)
V/(mW/cm2)
mW/cm2
mW/cm2
mW/cm2 s s
Notes: 1. Testcondition:usingbluediffuselightofpeakwavelength(lP)460nmandspectralhalfwidth(Dl1/)5nmaslightsource. . Testcondition:usinggreendiffuselightofpeakwavelength(lP)54nmandspectralhalfwidth(Dl1/)35nmaslightsource. 3. Testcondition:usingreddiffuselightofpeakwavelength(lP)645nmandspectralhalfwidth(Dl1/)0nmaslightsource. 4. Saturationirradiance=(Max.outputvoltageswing)/(Irradianceresponsivity). 5.Testcondition:TheriseandfalltimeismeasuredwithRClowpassfilteraddedtosensoroutput: Gain Selection GS:00toGS:01 GS:10 Rext 15k 15k Cext 1nF 6.8nF
RED CHANNEL R C RED CHANNEL
SIGNAL GENERATOR
+ -
- + LED
VRout Rext Cext
Vout
RC LOWPASS FILTER
TEST CIRCUIT
FOR ILLUSTRATION PURPOSE, ONLY RED CHANNEL IS SHOWN. THE SAME CIRCUIT APPLIES TO GREEN AND BLUE CHANNELS.
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Gain Selection Feedback Resistor Table GS: Bit 1 Bit 0 0 0 0 1 1 0
Feedback Resistor, RF 4M 7M 1M
Notes: 1. Gainsselections,GS:Bit1Bit0areapplicableforeachRed,GreenandBlueChannel. . Gainselectionsforeachchannelcanbeselectedindependentlyofeachother. 3. Feedbackresistorvalueisproportionaltoresponsivity.Refertoblockdiagrambelow. 4. 0indicatesthatthepinisconnectedtoground.1indicatesnoconnection.
RF CF - +
GS (1:0)
TRANSIMPEDANCE AMP
Typical Characteristics
1.2 1.0
NORMALIZED SENSITIVITY
RED
0.8 0.6 0.4 0.2 0 350
GREEN BLUE
450
550
650
750
WAVELENGTH (nm)
Figure 1. Spectral responsivity.
Note: TestconditioniswhenGainSelectionJumpersaresetto GSBLUE1=0 GSGRN1=0 GSRED1=0 GSBLUE0=1 GSGRN0=1 GSRED0=1 inwhich0=connecttoGround,1=noconnection.RefertoGainSelectionFeedbackResistorTable.
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0.03 0.025 0.02 0.015 0.01 0.005 0 -40
VOLTAGE OUTPUT - VO (V)
4.8 4.4 4.0 3.6 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0
GS:10
GS:01
GS:00
VD - DARK VOLTAGE (V)
-20
0
20
40
60
80
0
0.2
0.4
0.6
0.8
1.0
TA - OPERATING TEMPERATURE (C)
IRRADIANCE - Ee (mW/cm2)
Figure 2. Dark voltage vs. operating temperature.
Figure 3. Voltage output of Blue Channel vs. irradiance (lp = 460 nm).
4.8 4.4
VOLTAGE OUTPUT - VO (V)
VOLTAGE OUTPUT - VO (V)
4.0 3.6 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0
GS:10 GS:01
GS:00
4.8 4.4 4.0 3.6 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0
GS:10
GS:01
GS:00
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
IRRADIANCE - Ee (mW/cm2)
IRRADIANCE - Ee (mW/cm2)
Figure 4. Voltage output of Green Channel vs. irradiance (lp = 542 nm).
Figure 5. Voltage output of Red Channel vs. irradiance (lp = 645 nm).
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Recommended Reflow Profile ItisrecommendedthatHenkelPb-freesolderpasteLF310 be used for soldering HDJD-S7-QR999. Below is the recommendedreflowprofile.
T-peak T-reflow
230 5C 218C DELTA-FLUX = 2C/sec. max.
T-max.
160C 120C
DELTA-COOLING = 2C/sec. max.
TEMPERATURE
T-min.
DELTA-RAMP = 1C/sec. max.
40-60 sec. max.
t-pre
20-40 sec. max.
t-reflow
TIME
Figure 6. Recommended reflow soldering profile.
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16 Lead QFN Recommended PCB Land Pad Design
IPC-SM-78isusedasthestandardforthePCBland-pad design.RecommendedPCBfinishingisgoldplated.
0.8 mm
Recommendations for Handling and Storage of HDJDS722-QR999
This product is qualified as Moisture Sensitive Level 4 per Jedec J-STD-00. Precautions when handling this moisture sensitive product is important to ensure the reliabilityoftheproduct.DorefertoAvagoApplication Note AN5305 Handling Of Moisture Sensitive Surface MountDevicesfordetails.
A. Storagebeforeuse * Unopenedmoisturebarrierbag(MBB)canbestored at30Cand90%RHorlessformaximum1year 3.19 mm 5.5 mm * It is not recommended to open the MBB prior to assembly(e.g.forIQC) * It should also be sealed with a moisture absorbent material (Silica Gel) and an indicator card (cobalt chloride)toindicatethemoisturewithinthebag B. ControlafteropeningtheMBB * The humidity indicator card (HIC) shall be read immediatelyuponopeningofMBB 3.9 mm * The components must be kept at <30C/60%RH at 5.5 mm all time and all high temperature related process including soldering, curing or rework need to be Figure 7. completedwithin7hrs C. Controlforunfinishedreel * Foranyunusedcomponents,theyneedtobestored 16 Lead QFN Recommended Stencil Design insealedMBBwithdesiccantordesiccatorat<5%RH A stencil thickness of .18 mm (6 mils) for this QFN D. Controlofassembledboards packageisrecommended. * If the PCB soldered with the components is to be subjected to other high temperature processes, the PCBneedtobestoredinsealedMBBwithdesiccantor 0.8 mm desiccatorat<5%RHtoensurenocomponentshave exceededtheirfloorlifeof7hrs E. Bakingisrequiredif: 0.4 mm 0.8 mm * "10%"or"15%"HICindicatorturnspink * The components are exposed to condition of >30C/60%RHatanytime. * Thecomponentsfloorlifeexceeded7hrs * Recommended baking condition (in component form):15Cfor4hrs
3.19 mm 0.8 mm
0.4 mm
2.18 mm
Figure 8.
Package Tape and Reel Dimensions
4.00 0.10 SEE NOTE #2 2.00 0.05 SEE NOTE #2 B 1.55 0.05 R 0.50 TYP. 1.75 .10 5.50 0.05 Bo A Ko SECTION B-B Ao A o: B o: K o: PITCH: WIDTH: 5.30 5.30 2.20 8.00 12.00 A 12.00 0.10
B
8.00 0.10
1.50 (MIN.)
0.30 0.05 SECTION A-A NOTES: 1. Ao AND Bo MEASURED AT 0.3 mm ABOVE BASE OF POCKET. 2. 10 PITCHES CUMULATIVE TOLERANCE IS 0.2 mm. 3. DIMENSIONS ARE IN MILLIMETERS (mm).
Reel Dimensions
65 R10.65 45 +1.5* 12.4 -0.0
R5.2
45
55.0 0.5 178.0 0.5
176.0 EMBOSSED RIBS RAISED: 0.25 mm WIDTH: 1.25 mm
BACK VIEW
512
18.0 MAX.*
NOTES: 1. *MEASURED AT HUB AREA. 2. ALL FLANGE EDGES TO BE ROUNDED.
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ESD WARNING: Standard CMOS handling precautions should be observed to avoid static discharge.
AVAGO TECHNOLOGIES' PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO TECHNOLOGIES OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0136EN AV01-0686EN - January 8, 2007
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